In a recent update shared during Intel's Q3 2024 earnings report, CEO Pat Gelsinger discussed what the company will bring to the consumer market in the next few years, including updates on the new packaging designs for Panther Lake and Nova Lake CPUs.

Addressing concerns over the current performance of Intel's CPU lineup, which has faced challenges in a competitive market, Gelsinger (via Seeking Alpha) emphasised the company's commitment to revitalising its portfolio and boosting revenue through a renewed focus on mobile processors. Intel plans to introduce a more traditional packaging design for its mobile platform, moving away from the current one used in Lunar Lake.

Those familiar with its package will note that its designs include integrated memory options, offering 16 GB or 32 GB RAM configurations. While Lunar Lake saw success as a specialised product, Gelsinger pointed out that its complicated integration of LPDDR5X memory is not a sustainable business model moving forward. As such, the upcoming Panther Lake, scheduled for a 2025 launch, and the Nova Lake series will return to a conventional packaging design. Both lineups will eliminate the on-package memory and focus instead on a more scalable solution that meets the requirements of AI-driven PC applications.

For the production of these platforms, Intel plans to reduce product outsourcing. Approximately 70% of the Panther Lake CPU die will be produced in-house at Intel's foundries. However, the company still plans to outsource a portion of manufacturing to maintain foundry profitability.

Gelsinger also acknowledged past criticisms regarding the overwhelming number of SKUs in the Lunar Lake lineup, where products often shared remarkably similar specifications. Intel aims to streamline its offerings by curating a more focused SKU pipeline to simplify consumer choices. Lastly, it also mentioned it will focus more on integrated graphics, reducing the need for discrete GPUs in the future.